BONDERITE C-IC 61110 is formulated based on inorganic acids and specific surfactants designed to react with aluminum oxide ($Al_2O_3$). The mechanism involves a controlled etching rate that dissolves the passive oxide layer and exposes the metallic aluminum matrix. This process increases the surface free energy and roughness at a microscopic level, significantly enhancing the mechanical interlocking and chemical bonding of subsequent layers. It effectively desmuts the surface by dissolving alloying elements residues.